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1100-2 Series - 1.00mm Clamshell BGA-LGA SocketWells CTI
Wells-CTI 1.00mm pitch Lidded BGA/LGA Sockets
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Wells-CTI 1.00mm pitch Lidded BGA/LGA Sockets
  • Clamshell design
  • Through hole contact tails
  • Two points of contact per solder ball
  • Board mounting features
  • Low normal force
  • 10:1 mechanical advantage lid for high ball count packages available.
1100_02.pdf
Wells CTI
1100-2 Series - 1.00mm Clamshell BGA-LGA Socket
1100_02.pdf
1100-3 Series - 1.27mm Clanshell BGA/LGA SocketWells CTI
Wells-CTI 1.27mm pitch Lidded BGA/LGA Sockets
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Wells-CTI 1.27mm pitch Lidded BGA/LGA Sockets
  • Clamshell design
  • Through hole contact tails
  • Board mounting features
  • Low normal force
  • 10:1 mechanical advantage lid for high ball count packages availableLow profile lids available
1100_03.pdf
Wells CTI
1100-3 Series - 1.27mm Clanshell BGA/LGA Socket
1100_03.pdf
1.00mm Liddded BGA-LGA Socket3M Textool
3M™ Textool™ 1.00mm pitch Lidded BGA/LGA Sockets have a modular design providing a socket that mates with almost any 1.00mm pitch package.
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3M™ Textool™ 1.00mm pitch Lidded BGA/LGA Sockets have a modular design providing a socket that mates with almost any 1.00mm pitch package.
The socket contacts are inserted to match the ball count and pattern of your package.
  • Highly reliable contact that allows for normal variation in BGA ball-diameter and position
  • Low spring rate design achieves minimal solder ball deformation while allowing up to a 0.2mm range in package thickness tolerance
  • Device size available - 23mm² - matrix 21 x 21, 45mm² - matrix 39 x 39, 47.5mm² - matrix 45 x 45
3M Textool
1.00mm Liddded BGA-LGA Socket
1.27mm - 1.50mm Lidded BGA-LGA Socket3M Textool
3M™ Textool™ 1.27mm pitch Lidded BGA/LGA Sockets are standard or customised sockets in a 1.27mm pitch. The socket contacts are inserted to match the ball count and pattern or your pa ...
Read more ...
3M™ Textool™ 1.27mm pitch Lidded BGA/LGA Sockets are standard or customised sockets in a 1.27mm pitch. The socket contacts are inserted to match the ball count and pattern or your package.
  • Modular construction allows for cost effective socket proliferation for standard and custom packages
  • Coarse alignment on device body followed by a secondary fine alignment to the solder balls
  • Flat contact head that provides for minimum solder ball deformation
  • Can be adapted to either BGA or LGA formats
3M Textool
1.27mm - 1.50mm Lidded BGA-LGA Socket
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