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3M™ Textool™ 1.00mm pitch Lidded BGA/LGA Sockets have a modular design providing a socket that mates with almost any 1.00mm pitch package.
The socket contacts are inserted to match the ball count and pattern of your package.
- Highly reliable contact that allows for normal variation in BGA ball-diameter and position
- Low spring rate design achieves minimal solder ball deformation while allowing up to a 0.2mm range in package thickness tolerance
- Device size available - 23mm² - matrix 21 x 21, 45mm² - matrix 39 x 39, 47.5mm² - matrix 45 x 45